Dual Pulse Power Supply: Applications and basic concepts of pulse power supplies in electroplating, dual pulse electroplating power supply - pulse electroplating power supply
Dual pulse power supply electroplating process, that is, using photoelectrocatalytic methods to restore metal ions to metal materials, and produce a smooth, high-density metal material soil layer that meets the specifications on the surface of metal or non-metal materials. The coating properties after the electroplating process have largely replaced the original conventional properties, and have the functions of decoration and protection. With technological advancements and improvements in production capacity, electroplating has been playing an irreplaceable role in various industries.
Puli recommends the application of pulse power supplies in electroplating processes:
Current is a necessary condition for electroplating processes in plating tanks. The metal coating on the workpiece is produced by the electrochemical corrosion caused when the current passes through the electroplating tank.
According to the basic concepts of electroplating, there are two ways to improve the quality of electroplating: adjusting the electroplating solution; improving the electroplating power supply. In practice, people generally choose to improve the electroplating power supply to improve the properties of the electroplating process. In the development process of electroplating power supplies, pulse power supplies composed of fully controlled power switching components are a reform of electroplating power supplies. This type of power supply has a small size, good performance, low harmonic distortion, and is not easily affected by the output current.
Puli recommends the basic concepts of pulse power supply electroplating process:
Pulse power supply electroplating is a new electroplating technology. Its characteristics are determined by the effects of surge current on the dynamics model of the electrode process, the most important of which is the effect on the convective heat transfer process. During DC plating, the plated metal ions in the plating solution are gradually consumed in the solution around the cathode surface, resulting in a difference in concentration between the plated metal ions at this point and the corresponding positive ions in the solution. This difference increases with the increase in the applied current intensity. When the concentration of the positive ions in the liquid layer around the cathode drops to 0, the limiting current intensity is reached, and the convective heat transfer process is completely controlled by diffusion.
However, during single-pulse electroplating, due to the existence of the relevant off-time, the consumed metal ions use this time to diffuse outward and replenish to the cathode surroundings. When the on-off time is temporarily stopped, the concentration of metal ions around the cathode is restored, so a higher current intensity can be used; therefore, the difference between the convective heat transfer process during single-pulse electroplating and the convective heat transfer process during DC plating leads to the peak current being much higher than the average current, promoting the crystallization rate far exceeding the crystallization growth rate, making the coating crystals optimized, densely arranged, with reduced porosity, and low resistance.
Moreover, the adsorption and desorption processes of various substances on the cathode surface under the continuous cathode polarization potential difference during DC plating and the adsorption and desorption processes under the interrupted high cathode polarization potential difference under single-pulse conditions have very different principles, resulting in the same solution formula and preservatives having very different effects when the power supply waveform is different.
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