Dual pulse electroplating power supply: Application of pulse power supply in electroplating process
Dual pulse plating power supply plating process, that is, using photoelectrocatalytic methods to restore metal ions to metal materials, and produce a smooth, high-density metal material soil layer that meets the regulations on the surface of metal or non-metal manufacturing. The coating properties after the plating process have replaced the original conventional properties to a very large extent, and have the functions of decoration and safety protection. With technological progress and the improvement of production capacity, electroplating has been playing an irreplaceable role in various industries.
Puli recommends the application of pulse power supply in electroplating process:
Dual pulse power supply The current is a necessary condition for the electroplating process of the plating tank, and the metal coating on the workpiece is generated by the electrochemical corrosion caused when the current passes through the electroplating tank.
DC plating power supply According to the basic concept of electroplating, there are two ways to improve the quality of electroplating: adjusting the electroplating solution; improving the plating power supply. In practice, people generally choose to improve the plating power supply to improve the characteristics of the electroplating process. In the development process of plating power supplies, pulse power supplies composed of fully controlled power switching components are a reform of plating power supplies. This type of power supply has a small size, good performance, low harmonic distortion index, and is not easily affected by the output current.
Puli recommends the basic concept of pulse power supply electroplating process:
Pulse power supply electroplating is a new electroplating technology. Its characteristics are determined by the effect of surge current on the dynamics model of the electrode process, the most important of which is the effect on the convective heat transfer process. During DC plating, the metal ions plated out in the plating solution are gradually consumed in the solution around the cathode surface, resulting in a difference in concentration between the plated metal ions at this point and the corresponding positive ions in the solution. This difference increases with the increase of the applied current intensity. When the concentration of the positive ions in the liquid layer around the cathode drops to 0, the limiting current intensity is reached, and the convective heat transfer process is completely controlled by diffusion.
However, during single-pulse electroplating, due to the existence of the relevant off-time, the consumed metal ions use this time to diffuse outward and replenish to the cathode periphery. When the on-off time comes, the concentration of metal ions around the cathode is restored, so a higher current intensity can be used; therefore, the difference between the convective heat transfer process during single-pulse electroplating and the convective heat transfer process during DC plating leads to the fact that the peak current can be much higher than the average current, which promotes the rate of crystal formation far exceeding the rate of crystal growth, making the coating crystals optimized, densely arranged, reduced porosity, and low resistance.
Moreover, the adsorption and desorption processes of various substances on the cathode surface under the continuous cathode polarization potential difference during DC plating are very different from the adsorption and desorption processes under the interrupted high cathode polarization potential difference under single-pulse conditions, resulting in the same solution formula and preservatives. The effects are also very different if the power supply waveform is different.
The pulse power supply has a single-pulse current flow, and can generate a high-density current instantaneously; therefore, during electroplating, the bottom layer should be evenly coated on the workpiece, and it is accelerated to improve efficiency; the surface of the workpiece is uniform and delicate, making gold and silver and other precious metals obtain great savings. Therefore, it can be seen that single-pulse plating power supplies, especially power transformers, that can adjust the slew rate and frequency will be widely used.
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