Precious Metal Electroplating Power Supply: Characteristics and Efficacy of Electroplating Process Ballast! Dual Pulse Electroplating Power Supply - Dual Pulse Power Supply
Precious Metal Electroplating Power Supply. The electroplating process ballast uses high-quality imported IGBTs as the main power electronic components, and uses ultra-nanocrystalline (also known as nanocrystalline) soft magnetic alloy products to dominate the transformer coils. The main automatic control system uses a multi-loop control system, and the structure adopts anti-corrosion alkalization measures. The switching power supply products are reasonably configured and reliable.
Features of the electroplating process ballast recommended by Puri:
1. Small size and light weight: The volume and net weight are 1/5-1/10 that of thyristor electroplating process ballasts, which is beneficial for your overall planning, reconstruction, movement, maintenance, and installation.
2. Excellent environmental protection and energy saving effects: Because the high-frequency transformer is used for the power transformer, the conversion efficiency is further improved. Under normal circumstances, the efficiency is improved by more than 10% compared with thyristor equipment, and the efficiency is improved by more than 30% compared with thyristor equipment when the load rate is below 70%.
3. High output reliability: Because the system response is sensitive (second-level), it has strong adaptability to grid electricity and load changes, and the output accuracy can be better than 1%. The power transformer has high efficiency, so the linearity is high, which helps to improve product quality.
4. Output waveform is easy to adjust: Because of the high output power, the adjustment of its output waveform has a relatively low solution cost, and the output waveform can be changed more conveniently according to customer process requirements. This has a strong effect on improving efficiency and improving the quality of processed products at the work site.
Functions of the electroplating process ballast recommended by Puri:
1. Reduce porosity, the nucleation rate exceeds the growth rate, and promote nucleation optimization.
2. Improve the bonding property, penetrate the passivation film, and facilitate the firm bonding between the substrate and the coating.
3. Improve the covering ability and dispersion ability. The high negative charge of the cathode makes it possible to deposit even in the passivated areas in general electroplating processes, alleviating the defects of "burning" and "network" deposition caused by excessive consumption of positive ions in prominent areas of complex-shaped parts. For obtaining a coating with given characteristics (such as color, no pores, etc.), the thickness can be reduced to 1/3~1/2 of the original, saving raw materials.
4. Reduce the thermal stress of the coating, improve the lattice constant defects, residues, cracks, tumors, etc., easily obtain crack-free coatings, and reduce the corrosion inhibitor.
5. It is beneficial to obtain an aluminum alloy coating with stable composition.
6. Improve anodic oxidation dissolution, no anodic oxidation activator is required.
7. Improve the mechanical properties of the coating, such as increasing the relative density, reducing the surface resistivity and volume resistivity, improving ductility, wear resistance, corrosion resistance, and controlling the coating strength.
The above is the content collected by the editor of Guangzhou Puri Electric Co., Ltd. Please contact us if you need customization.
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